Material Type:High-strength, corrosion-resistant aluminum alloy
Electrostatic Control:Advanced electrostatic force regulation system
Temperature Range:-40°C to 150°C
Vacuum Compatibility:Up to 1 x 10^-6 Torr
Dimension (WxDxH):315mm x 315mm x 50mm
Max Load Capacity:15kg
The LAM ELECTROSTATIC CHUCK 839-800327-315 is engineered to provide unparalleled stability during plasma etching and deposition processes, essential for achieving superior microelectronics fabrication quality.
Crafted from high-grade stainless steel, this chuck ensures durability and resistance to corrosion, making it suitable for long-term use in the most demanding environments.
With adjustable electrostatic force, our chuck offers precise control over wafer holding, minimizing slippage and enhancing process yield.
Adaptable to various vacuum systems, it seamlessly integrates with existing semiconductor manufacturing equipment, streamlining your production workflow and reducing setup times.
Designed for optimal performance across a wide temperature range, it maintains consistent chucking force even under extreme conditions, ensuring reliable operation throughout the manufacturing process.
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